DayOne Data Centers is seeking a HK$1.86 billion ($237 million) loan, according to people familiar with the matter, adding to the company’s recent borrowing spree ahead of a planned US initial public offering.
DayOne Data Centers is seeking a HK$1.86 billion ($237 million) loan, according to people familiar with the matter, adding to the company’s recent borrowing spree ahead of a planned US initial public offering.
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